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Journal description
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Details for article 3 of 8 found articles
| Title: |
Evaluation of interfacial fracture toughness of a flip-chip package and a bimaterial system by a combined experimental and numerical method |
| Author: |
Wang, Jianjun Zou, Daqing Lu, Minfu Ren, Wei Liu, Sheng |
| Appeared in: |
Engineering fracture mechanics |
| Paging: | Volume 64 (1999) nr. 6 pages 17 p. |
| Year: |
1999 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 8 found articles
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