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  Analytical study on a new bond test method for measuring adhesion
 
 
Title: Analytical study on a new bond test method for measuring adhesion
Author: Cheng, Y.-S.
Douglas, W.H.
Versluis, A.
Tantbirojn, D.
Appeared in: Engineering fracture mechanics
Paging: Volume 64 (1999) nr. 1 pages 7 p.
Year: 1999
Contents:
Publisher: Elsevier Science Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 2 of 8 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands