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Journal description
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Details for article 16 of 16 found articles
| Title: |
Thermal fatigue life prediction of flip chip solder joints by fracture mechanics method |
| Author: |
Lau, John H. |
| Appeared in: |
Engineering fracture mechanics |
| Paging: | Volume 45 (1993) nr. 5 pages 12 p. |
| Year: |
1993 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 16 of 16 found articles
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