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                                       Details for article 12 of 13 found articles
 
 
  Thermal stress intensity factors for an interfacial crack on a cusp-type inclusion
 
 
Title: Thermal stress intensity factors for an interfacial crack on a cusp-type inclusion
Author: Kang Yong Lee,
Yong Hoon Jang,
Appeared in: Engineering fracture mechanics
Paging: Volume 44 (1993) nr. 3 pages 14 p.
Year: 1993
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 12 of 13 found articles
 
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