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  A bond-based peridynamic model and implicit solution for thermo-elastoplastic fracture analysis
 
 
Title: A bond-based peridynamic model and implicit solution for thermo-elastoplastic fracture analysis
Author: Gu, Xin
Wu, Yangguang
Zhang, Zixu
Li, Hui
Zhang, Yixiong
Wang, Lei
Appeared in: Engineering fracture mechanics
Paging: Volume 326 () nr. C pages p.
Year: 2025
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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