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                                       Details for article 18 of 37 found articles
 
 
  Influence of microvoid on fatigue behaviour and crack initiation of TSV-Cu under thermal cyclic loading based on the stored energy density indication
 
 
Title: Influence of microvoid on fatigue behaviour and crack initiation of TSV-Cu under thermal cyclic loading based on the stored energy density indication
Author: Qian, Hongjiang
Huang, Zhiyong
Zhu, Qingyun
Xu, Yilun
Wang, Haomin
Appeared in: Engineering fracture mechanics
Paging: Volume 323 () nr. C pages p.
Year: 2025
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 18 of 37 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands