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Journal description
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Details for article 77 of 78 found articles
| Title: |
The peeling behavior of film/substrate systems with periodic and discontinuous bonding |
| Author: |
Wang, Y.S. Wang, K.F. Wang, B.L. |
| Appeared in: |
Engineering fracture mechanics |
| Paging: | Volume 310 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 77 of 78 found articles
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