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Journal description
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Details for article 57 of 67 found articles
| Title: |
Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging |
| Author: |
Du, Yihui Ji, Xiaoliang Lin, Sijia Liu, Aiwei Wang, Yishu Wu, Yufeng Guo, Fu |
| Appeared in: |
Engineering fracture mechanics |
| Paging: | Volume 307 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 57 of 67 found articles
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