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Journal description
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Details for article 25 of 46 found articles
| Title: |
Grain orientations and failure mechanism of isothermal aged nano Sn-3Ag-0.5Cu/Cu solder joints by microwave hybrid heating and shear mechanical strength |
| Author: |
Zhang, Shuai Zhou, Hongzhi Ding, Tianran Long, Weimin Zhong, Sujuan Paik, Kyung-Wook He, Peng Zhang, Shuye |
| Appeared in: |
Engineering fracture mechanics |
| Paging: | Volume 298 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 25 of 46 found articles
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