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Journal description
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Details for article 38 of 44 found articles
| Title: |
Simulation of crack propagation in solder layer of IGBT device under temperature shock by viscoplastic phase field method |
| Author: |
Yang, Kai Zhou, Longzao Wu, Fengshun Yang, Guang Ding, Liguo Li, Kewei Li, Xuemin |
| Appeared in: |
Engineering fracture mechanics |
| Paging: | Volume 284 () nr. C pages p. |
| Year: |
2023 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 38 of 44 found articles
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