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  Crack analysis using a hybrid numerical manifold method with node-based strain smoothing and double-interpolation
 
 
Title: Crack analysis using a hybrid numerical manifold method with node-based strain smoothing and double-interpolation
Author: Han, Wenshuai
Wang, Shuhong
Liu, Wenfang
Sun, Wenpan
Hou, Qinkuan
Zhang, Simiao
Wei, Wei
Appeared in: Engineering fracture mechanics
Paging: Volume 273 () nr. C pages p.
Year: 2022
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 5 of 25 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands