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                                       Details for article 12 of 28 found articles
 
 
  Experiment and theoretical prediction for subsurface microcracks and damage depth of multi-crystalline silicon wafer in diamond wire sawing
 
 
Title: Experiment and theoretical prediction for subsurface microcracks and damage depth of multi-crystalline silicon wafer in diamond wire sawing
Author: Li, Xinying
Gao, Yufei
Liu, Runtao
Zhou, Wei
Appeared in: Engineering fracture mechanics
Paging: Volume 266 () nr. C pages p.
Year: 2022
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 12 of 28 found articles
 
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