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Journal description
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Details for article 21 of 45 found articles
| Title: |
Fatigue cracking growth of SAC305 solder ball under rapid thermal shock |
| Author: |
Liu, Cong Xia, Daquan Tian, Mizhe Chen, Shiqi Gan, Guisheng Du, Yunfei Liu, Xin Jiang, Zhaoqi Wu, Yiping Ma, Yanlong |
| Appeared in: |
Engineering fracture mechanics |
| Paging: | Volume 259 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 21 of 45 found articles
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