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                                       Details for article 15 of 31 found articles
 
 
  Equivalent thickness-based three dimensional stress fields and fatigue growth of part-through cracks emanating from a circular hole
 
 
Title: Equivalent thickness-based three dimensional stress fields and fatigue growth of part-through cracks emanating from a circular hole
Author: Guo, Wei
Zhu, Jiacai
Guo, Wanlin
Appeared in: Engineering fracture mechanics
Paging: Volume 228 () nr. C pages p.
Year: 2020
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 15 of 31 found articles
 
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