Digital Library
Close Browse articles from a journal
 
<< previous    next >>
     Journal description
       All volumes of the corresponding journal
         All issues of the corresponding volume
           All articles of the corresponding issues
                                       Details for article 15 of 16 found articles
 
 
  The numerical manifold method for crack modeling of two-dimensional functionally graded materials under thermal shocks
 
 
Title: The numerical manifold method for crack modeling of two-dimensional functionally graded materials under thermal shocks
Author: Zhang, H.H.
Liu, S.M.
Han, S.Y.
Fan, L.F.
Appeared in: Engineering fracture mechanics
Paging: Volume 208 (2019) nr. C pages 90-106
Year: 2019
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 15 of 16 found articles
 
<< previous    next >>
 
 Koninklijke Bibliotheek - National Library of the Netherlands