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Journal description
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Details for article 23 of 35 found articles
| Title: |
Microstructure and size effect of interfacial intermetallic on fracture toughness of Sn3.0Ag0.5Cu solder interconnects |
| Author: |
Wang, Shaobin Yao, Yao Wang, Wenjie |
| Appeared in: |
Engineering fracture mechanics |
| Paging: | Volume 202 (2018) nr. C pages 259-274 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 23 of 35 found articles
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