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Journal description
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Details for article 18 of 54 found articles
| Title: |
Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints |
| Author: |
Thompson, Patrick B. Johnson, Richard Nadimpalli, Siva P.V. |
| Appeared in: |
Engineering fracture mechanics |
| Paging: | Volume 199 (2018) nr. C pages 730-738 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 18 of 54 found articles
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