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Journal description
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Details for article 9 of 25 found articles
| Title: |
Effect of thermal misfit stress on steam-driven delamination in electronic packages |
| Author: |
Zhang, Xian Meng, Haoran Wang, Hehui Guo, Fenglin |
| Appeared in: |
Engineering fracture mechanics |
| Paging: | Volume 194 (2018) nr. C pages 61-72 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 9 of 25 found articles
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