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                                       Details for article 21 of 30 found articles
 
 
  Identification of damage and fracture modes in power electronic packaging from experimental micro-shear tests and finite element modeling
 
 
Title: Identification of damage and fracture modes in power electronic packaging from experimental micro-shear tests and finite element modeling
Author: Msolli, S.
Baazaoui, A.
Alexis, J.
Kim, H.S.
Appeared in: Engineering fracture mechanics
Paging: Volume 188 (2018) nr. C pages 470-492
Year: 2018
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 21 of 30 found articles
 
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