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Journal description
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Details for article 23 of 26 found articles
| Title: |
Predicting delamination in multilayer composite circuit boards with bonded microelectronic components |
| Author: |
Akbari, Saeed Nourani, Amir Spelt, Jan K. |
| Appeared in: |
Engineering fracture mechanics |
| Paging: | Volume 187 () nr. C pages 225-240 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 23 of 26 found articles
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