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                                       Details for article 8 of 27 found articles
 
 
  Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide
 
 
Title: Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide
Author: Wang, Peizhi
Ge, Peiqi
Bi, Wenbo
Ge, Mengran
Liu, Tengyun
Appeared in: Engineering fracture mechanics
Paging: Volume 184 (2017) nr. C pages 273-285
Year: 2017
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 8 of 27 found articles
 
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