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                                       Details for article 20 of 28 found articles
 
 
  Mixed-mode cohesive zone parameters for sub-micron scale stacked layers to predict microelectronic device reliability
 
 
Title: Mixed-mode cohesive zone parameters for sub-micron scale stacked layers to predict microelectronic device reliability
Author: Raghavan, Sathyanarayanan
Schmadlak, Ilko
Leal, George
Sitaraman, Suresh K.
Appeared in: Engineering fracture mechanics
Paging: Volume 153 (2016) nr. C pages 19 p.
Year: 2016
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 20 of 28 found articles
 
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