|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 11 of 15 found articles
| Title: |
Effects of void–crack interaction and void distribution on crack propagation in single crystal silicon |
| Author: |
Wang, Liang Liu, Qunfeng Shen, Shengping |
| Appeared in: |
Engineering fracture mechanics |
| Paging: | Volume 146 (2015) nr. C pages 11 p. |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 11 of 15 found articles
| << previous | next >> |