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Journal description
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Details for article 3 of 15 found articles
| Title: |
An analytical study on steam-driven delamination and stability of delamination growth in electronic packages |
| Author: |
Guo, F.L. Niu, X. He, B.B. |
| Appeared in: |
Engineering fracture mechanics |
| Paging: | Volume 144 (2015) nr. C pages 12 p. |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 15 found articles
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