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                                       Details for article 8 of 17 found articles
 
 
  Development of single cantilever beam method to measure the adhesion of thin film adhesive on silicon chip
 
 
Title: Development of single cantilever beam method to measure the adhesion of thin film adhesive on silicon chip
Author: Shin, DongKil
Lee, JungJu
Yoon, ChulKeun
Lee, GyuJei
Hong, JoonKi
Kim, NamSuk
Appeared in: Engineering fracture mechanics
Paging: Volume 133 (2015) nr. C pages 179-190
Year: 2015
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 8 of 17 found articles
 
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