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                                       Details for article 2 of 7 found articles
 
 
  Delamination crack initiation from copper/silicon nitride interface edge with nanoscale singular stress field
 
 
Title: Delamination crack initiation from copper/silicon nitride interface edge with nanoscale singular stress field
Author: Kawai, Emi
Sanada, Kazunori
Sumigawa, Takashi
Kitamura, Takayuki
Appeared in: Engineering fracture mechanics
Paging: Volume 120 (2014) nr. C pages 7 p.
Year: 2014
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 2 of 7 found articles
 
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