|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 6 of 8 found articles
| Title: |
Prediction of thermo-mechanical fatigue for solder joints in power electronics modules under passive temperature cycling |
| Author: |
Sun, Z. Benabou, L. Dahoo, P.R. |
| Appeared in: |
Engineering fracture mechanics |
| Paging: | Volume 107 (2013) nr. C pages 13 p. |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 6 of 8 found articles
| << previous | next >> |