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                                       Details for article 6 of 8 found articles
 
 
  Prediction of thermo-mechanical fatigue for solder joints in power electronics modules under passive temperature cycling
 
 
Title: Prediction of thermo-mechanical fatigue for solder joints in power electronics modules under passive temperature cycling
Author: Sun, Z.
Benabou, L.
Dahoo, P.R.
Appeared in: Engineering fracture mechanics
Paging: Volume 107 (2013) nr. C pages 13 p.
Year: 2013
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 6 of 8 found articles
 
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