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                                       Details for article 10 of 40 found articles
 
 
  Enhancement of interfacial thermal conductance by introducing carbon vacancy at the Cu/diamond interface
 
 
Title: Enhancement of interfacial thermal conductance by introducing carbon vacancy at the Cu/diamond interface
Author: Wu, Kongping
Zhang, Leng
Li, Fangzhen
Sang, Liwen
Liao, Meiyong
Tang, Kun
Ye, Jiandong
Gu, Shulin
Appeared in: Carbon
Paging: Volume 223 () nr. C pages p.
Year: 2024
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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