|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 66 of 112 found articles
| Title: |
Mechanism of over-etching defects during Ta/TaN barrier resputtering in micro-trench for Cu metallization |
| Author: |
Tsao, Jung-Chih Liu, Chuan-Pu Wang, Ying-Lang Chen, Kei-Wei Lo, Kuang-Yao |
| Appeared in: |
Journal of physics and chemistry of solids |
| Paging: | Volume 69 (2008) nr. 2-3 pages 5 p. |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 66 of 112 found articles
| << previous | next >> |