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                                       Details for article 60 of 112 found articles
 
 
  Interface integration defect of copper and low-K materials beyond nano-scale copper damascene process
 
 
Title: Interface integration defect of copper and low-K materials beyond nano-scale copper damascene process
Author: Chen, Kei-Wei
Wang, Ying-Lang
Tsao, Jung-Chih
Juang, Yungder
Lee, Feng-Yi
Appeared in: Journal of physics and chemistry of solids
Paging: Volume 69 (2008) nr. 2-3 pages 4 p.
Year: 2008
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 60 of 112 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands