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Journal description
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Details for article 29 of 56 found articles
| Title: |
Kinetic Monte Carlo simulation of the electrodeposition of polycrystalline copper: Effects of substrates and deposition parameters on the microstructure of deposits |
| Author: |
Liu, Jun Liu, Changqing Conway, Paul P. |
| Appeared in: |
Electrochimica acta |
| Paging: | Volume 97 (2013) nr. C pages 11 p. |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 29 of 56 found articles
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