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                                       Details for article 16 of 83 found articles
 
 
  Cu-filled through-hole electrode for ZnS using high adhesive strength Ni–P thin film
 
 
Title: Cu-filled through-hole electrode for ZnS using high adhesive strength Ni–P thin film
Author: Okamoto, Naoki
Miyamoto, Megumi
Saito, Takeyasu
Kondo, Kazuo
Fukumoto, Takafumi
Hirota, Masaki
Appeared in: Electrochimica acta
Paging: Volume 82 (2012) nr. C pages 4 p.
Year: 2012
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 16 of 83 found articles
 
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