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                                       Details for article 19 of 88 found articles
 
 
  Copper electroless plating in weakly alkaline electrolytes using DMAB as a reducing agent for metallization on polymer films
 
 
Title: Copper electroless plating in weakly alkaline electrolytes using DMAB as a reducing agent for metallization on polymer films
Author: Kulyk, Nadiia
Cherevko, Serhiy
Chung, Chan-Hwa
Appeared in: Electrochimica acta
Paging: Volume 59 (2012) nr. C pages 7 p.
Year: 2012
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 19 of 88 found articles
 
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