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                                       Details for article 4 of 39 found articles
 
 
  Copper deposition onto silicon by galvanic displacement: Effect of Cu complex formation in NH4F solutions
 
 
Title: Copper deposition onto silicon by galvanic displacement: Effect of Cu complex formation in NH4F solutions
Author: daRosa, Calvin P.
Iglesia, Enrique
Maboudian, Roya
Appeared in: Electrochimica acta
Paging: Volume 54 (2009) nr. 12 pages 8 p.
Year: 2009
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 4 of 39 found articles
 
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