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Journal description
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Details for article 30 of 94 found articles
| Title: |
Electrodeposition of Sn–Bi lead-free solders: Effects of complex agents on the composition, adhesion, and dendrite formation |
| Author: |
Tsai, Yi-Da Hu, Chi-Chang Lin, Chi-Cheng |
| Appeared in: |
Electrochimica acta |
| Paging: | Volume 53 (2007) nr. 4 pages 8 p. |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 30 of 94 found articles
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