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  A novel inorganic leveler of sodium azide for high aspect ratio through-holes uniform Cu thickening with high throwing power by electronic plating
 
 
Title: A novel inorganic leveler of sodium azide for high aspect ratio through-holes uniform Cu thickening with high throwing power by electronic plating
Author: Wang, Zhao-Yun
Jin, Lei
Yang, Jia-Qiang
Zhao, Yi
Song, Tao
Zhan, DongPing
Yu, Da-quan
Yang, Fang-Zu
Sun, Shi-Gang
Appeared in: Electrochimica acta
Paging: Volume 528 () nr. C pages p.
Year: 2025
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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