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                                       Details for article 46 of 55 found articles
 
 
  Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—An electrochemical perspective
 
 
Title: Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—An electrochemical perspective
Author: Ein-Eli, Yair
Starosvetsky, David
Appeared in: Electrochimica acta
Paging: Volume 52 (2007) nr. 5 pages 14 p.
Year: 2007
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 46 of 55 found articles
 
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