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                                       Details for article 8 of 28 found articles
 
 
  Effect of plating mode, thiourea and chloride on the morphology of copper deposits produced in acidic sulphate solutions
 
 
Title: Effect of plating mode, thiourea and chloride on the morphology of copper deposits produced in acidic sulphate solutions
Author: Tantavichet, Nisit
Pritzker, Mark D.
Appeared in: Electrochimica acta
Paging: Volume 50 (2005) nr. 9 pages 13 p.
Year: 2005
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 8 of 28 found articles
 
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