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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
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Details for article 9 of 56 found articles
| Title: |
Bottom-up filling in Cu electroless deposition using bis-(3-sulfopropyl)-disulfide (SPS) |
| Author: |
Lee, Chang Hwa Lee, Sang Chul Kim, Jae Jeong |
| Appeared in: |
Electrochimica acta |
| Paging: | Volume 50 (2005) nr. 16-17 pages 6 p. |
| Year: |
2005 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 9 of 56 found articles
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