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                                       Details for article 3 of 23 found articles
 
 
  Cu microvia filling by pulse-reverse electrodeposition with a single accelerator
 
 
Title: Cu microvia filling by pulse-reverse electrodeposition with a single accelerator
Author: Seo, Huiju
Kim, Jounghee
Kang, Jungkyu
Park, Jong-Eun
Kim, Myung Jun
Kim, Jae Jeong
Appeared in: Electrochimica acta
Paging: Volume 490 () nr. C pages p.
Year: 2024
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 3 of 23 found articles
 
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