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Details for article 1142 of 28052 found articles
| Title: |
An effective triblock copolymer as a suppressor for microvia filling via copper electrodeposition |
| Author: |
Xiao, Ning Li, Deyu Cui, Guofeng Li, Ning Tian, Dong Li, Qing Wu, Gang |
| Appeared in: |
Electrochimica acta |
| Paging: | Volume 109 (2013) nr. C pages 7 p. |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 1142 of 28052 found articles
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