|
Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole |
|
|
|
Titel: |
Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole |
Auteur: |
Zheng, Li He, Wei Zhu, Kai Wang, Chong Wang, Shouxu Hong, Yan Chen, Yuanming Zhou, Guoyun Miao, Hua Zhou, Jinqun |
Verschenen in: |
Electrochimica acta |
Paginering: |
Jaargang 283 () nr. C pagina's 560-567 |
Jaar: |
2018 |
Inhoud: |
|
Uitgever: |
Elsevier Ltd |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
|
|
|
|