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Computational analysis and experimental evidence of two typical levelers for acid copper electroplating |
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Titel: |
Computational analysis and experimental evidence of two typical levelers for acid copper electroplating |
Auteur: |
Lai, Zhiqiang Wang, Shouxu Wang, Chong Hong, Yan Chen, Yuanming Zhang, Huaiwu Zhou, Guoyun He, Wei Ai, Kehua Peng, Yongqiang |
Verschenen in: |
Electrochimica acta |
Paginering: |
Jaargang 273 (2018) nr. C pagina's 318-326 |
Jaar: |
2018 |
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Uitgever: |
Elsevier Ltd |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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