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                                       Details for article 19 of 61 found articles
 
 
  Electrochemical plating of Cu-Sn alloy in non-cyanide solution to substitute for Ni undercoating layer
 
 
Title: Electrochemical plating of Cu-Sn alloy in non-cyanide solution to substitute for Ni undercoating layer
Author: Jung, Minkyeong
Lee, Gibaek
Choi, Jinsub
Appeared in: Electrochimica acta
Paging: Volume 241 (2017) nr. C pages 229-236
Year: 2017
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 19 of 61 found articles
 
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