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  Elucidating the interfacial interactions of copper and ammonia with the sulfur passive layer during thiosulfate mediated gold leaching
 
 
Title: Elucidating the interfacial interactions of copper and ammonia with the sulfur passive layer during thiosulfate mediated gold leaching
Author: Smith, Scott R.
Zhou, Chunqing
Baron, Janet Y.
Choi, Yeonuk
Lipkowski, Jacek
Appeared in: Electrochimica acta
Paging: Volume 210 (2016) nr. C pages 925-934
Year: 2016
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 50 of 118 found articles
 
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