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Journal description
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Details for article 21 of 64 found articles
| Title: |
Electrochemical Assembly of Thiol-based Monolayer on Copper for Epoxy-Cu Adhesion Improvement |
| Author: |
Kwok, Stephen C.T. Ciucci, Francesco Yuen, Matthew M.F. |
| Appeared in: |
Electrochimica acta |
| Paging: | Volume 121 (2014) nr. C pages 7 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 21 of 64 found articles
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