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Journal description
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Details for article 44 of 62 found articles
| Title: |
Plating Uniformity of Bottom-up Copper Pillars and Patterns for IC Substrates with Additive-assisted Electrodeposition |
| Author: |
Chen, Yuanming He, Wei Chen, Xianming Wang, Chong Tao, Zhihua Wang, Shouxu Zhou, Guoyun Moshrefi-Torbati, Mohamed |
| Appeared in: |
Electrochimica acta |
| Paging: | Volume 120 (2014) nr. C pages 9 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 44 of 62 found articles
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