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                                       Details for article 21 of 57 found articles
 
 
  Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
 
 
Title: Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
Author: Inoue, Fumihiro
Philipsen, Harold
Radisic, Aleksandar
Armini, Silvia
Civale, Yann
Leunissen, Peter
Kondo, Muneharu
Webb, Eric
Shingubara, Shoso
Appeared in: Electrochimica acta
Paging: Volume 100 (2013) nr. C pages 9 p.
Year: 2013
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 21 of 57 found articles
 
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