| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A new approach for handling and transferring of thin semiconductor materials
|
Bagdahn, J.
|
|
2003
|
9 |
3 |
p. 204-209
|
artikel
|
| 2 |
Chemical mechanical polishing as a toolbox for thin film magnetic head manufacturing
|
van Heeren, H.
|
|
2003
|
9 |
3 |
p. 155-158
|
artikel
|
| 3 |
Generation of 3-dimensional microstructure by metal jet
|
Yamaguchi, K.
|
|
2003
|
9 |
3 |
p. 215-219
|
artikel
|
| 4 |
High-aspect-ratio microstructures fabricated by X-ray lithography of polymethylsilsesquioxane-based spin-on glass thick films
|
Liu, Y.
|
|
2003
|
9 |
3 |
p. 171-175
|
artikel
|
| 5 |
Injection molding for microstructures controlling mold-core extrusion and cavity heat-flux
|
Yan, C.
|
|
2003
|
9 |
3 |
p. 188-191
|
artikel
|
| 6 |
LiGA measurement and acceptance evaluation
|
Dearth, B. L.
|
|
2003
|
9 |
3 |
p. 197-203
|
artikel
|
| 7 |
Mechanical behavior of aluminum foils as micro structural material under low velocity impact loading
|
Auzanneau, T.
|
|
2003
|
9 |
3 |
p. 183-187
|
artikel
|
| 8 |
Micro-structured flow fields for small fuel cells
|
Müller, M.
|
|
2003
|
9 |
3 |
p. 159-162
|
artikel
|
| 9 |
Numerical simulation of thermal distortions in deep and ultra deep X-ray lithography
|
Achenbach, S.
|
|
2003
|
9 |
3 |
p. 220-224
|
artikel
|
| 10 |
Restrictions in the design of gear wheel components and drives for micro technology
|
Albers, A.
|
|
2003
|
9 |
3 |
p. 192-196
|
artikel
|
| 11 |
Study of silicon backside damage in deep reactive ion etching for bonded silicon–glass structures
|
Yoshida, Y.
|
|
2003
|
9 |
3 |
p. 167-170
|
artikel
|
| 12 |
Surface roughness control by energy shift in deep X-ray lithography
|
Cheng, Y.
|
|
2003
|
9 |
3 |
p. 163-166
|
artikel
|
| 13 |
Ultra thin ICs and MEMS elements: techniques for wafer thinning, stress-free separation, assembly and interconnection
|
Feil, M.
|
|
2003
|
9 |
3 |
p. 176-182
|
artikel
|
| 14 |
Uncertainty in measurement of semiconductor piezoresistive sensors
|
Hoa, P. L. P.
|
|
2003
|
9 |
3 |
p. 210-214
|
artikel
|
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