| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A circular microchannel with integrated electrodes for DNA electrophoresis
|
Lerner, B.
|
|
2012
|
19 |
5 |
p. 733-742
|
artikel
|
| 2 |
Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy
|
Naumann, Falk
|
|
2012
|
19 |
5 |
p. 689-695
|
artikel
|
| 3 |
Aluminum–germanium wafer bonding of (AlGaIn)N thin-film light-emitting diodes
|
Goßler, Christian
|
|
2012
|
19 |
5 |
p. 655-659
|
artikel
|
| 4 |
An adsorption-based mercury sensor with continuous readout
|
Sarajlić, Milija
|
|
2012
|
19 |
5 |
p. 749-755
|
artikel
|
| 5 |
A novel movable electrode for realizing deep sub-micrometer gap in SOI-based MEMS square resonator
|
Jiang, J. W.
|
|
2012
|
19 |
5 |
p. 763-772
|
artikel
|
| 6 |
Characterization of bonded wafer stacks by use of the photoelastic-analysis-method
|
Geiler, H.
|
|
2013
|
19 |
5 |
p. 697-703
|
artikel
|
| 7 |
Direct bonding of titanium layers on silicon
|
Baudin, F.
|
|
2012
|
19 |
5 |
p. 647-653
|
artikel
|
| 8 |
Effect of bonding temperature on hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration
|
Fan, J.
|
|
2012
|
19 |
5 |
p. 661-667
|
artikel
|
| 9 |
Hydrophobic direct bonding of silicon reconstructed surfaces
|
Rauer, C.
|
|
2013
|
19 |
5 |
p. 675-679
|
artikel
|
| 10 |
Laser transmission bonding of silicon to silicon with metallic interlayers for wafer-level packaging
|
Wissinger, Anselm
|
|
2012
|
19 |
5 |
p. 669-673
|
artikel
|
| 11 |
Optimization of MEMS capacitive accelerometer
|
Benmessaoud, Mourad
|
|
2013
|
19 |
5 |
p. 713-720
|
artikel
|
| 12 |
Patterning of carbon nanotube films on PDMS using SU-8 microstructures
|
Kim, Dongil
|
|
2012
|
19 |
5 |
p. 743-748
|
artikel
|
| 13 |
Room temperature bonding for vacuum applications: climatic and long time tests
|
Langa, S.
|
|
2012
|
19 |
5 |
p. 681-687
|
artikel
|
| 14 |
Special issue on WaferBond‘11
|
|
|
2013
|
19 |
5 |
p. 645-646
|
artikel
|
| 15 |
The effect of atmospheric moisture on crack propagation in the interface between directly bonded silicon wafers
|
Masteika, V.
|
|
2012
|
19 |
5 |
p. 705-712
|
artikel
|
| 16 |
Thermoelastic dissipation in stepped-beam resonators
|
Tunvir, K.
|
|
2012
|
19 |
5 |
p. 721-731
|
artikel
|
| 17 |
Void-free trench isolation based on a new trench design
|
Li, Xiao-Ying
|
|
2012
|
19 |
5 |
p. 757-761
|
artikel
|
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